Mechanism for employing and facilitating placement of a sensor cover over a capacitive circuitry sensor at a computing device

ABSTRACT

A mechanism is described for employing and facilitating placing a sensor cover over an external sensor of a computing device. A method of embodiments of the invention includes sensing, at a sensor of a computing device, user touches to an outer surface of an impregnated sensor cover placed over the sensor, wherein the sensor cover includes a plurality of holes through the outer surface and a plurality of conductive leads corresponding to the plurality of holes, and wherein sensing is performed through one or more of the plurality of holes and their one or more corresponding conductive leads; and facilitating an action in response to each of the sensed user touches.

CROSS-REFERENCE TO RELATED APPLICATION

This patent application is a U.S. National Phase Application under 35U.S.C. §371 of International Application No. PCT/US2011/054413, filedSep. 30, 2011, entitled MECHANISM FOR EMPLOYING AND FACILITATINGPLACEMENT OF A SENSOR COVER OVER A CAPACITIVE CIRCUITRY SENSOR AT ACOMPUTING DEVICE.

FIELD

The field relates generally to computing devices and, more particularly,to employing a mechanism for employing and facilitating placement of asensor cover over a capacitive circuitry sensor at a computing device.

BACKGROUND

With the increase in the use of mobile device, it is gettingincreasingly important to make these devices easy to use (e.g., usingtouch panels) but without having to increase the cost, size orcomplexity and/or reduce value, efficiency or existing features. None ofthe current technologies satisfy the aforementioned standards. Forexample, one way to increase touch panel sensitivity or functionality isto add a number of extra components to the device (e.g., amicrocontroller, Central Processing Unit (CPU) drivers, cables orconnectors, etc.) which results in increased cost, size, complexity,etc. Further, with additional functionalities, computing devices aregetting increasingly complex and difficult operate. Further, theincreasing thinness of computing devices is making it extremelydifficult for these computing devices to employ a circuitry that cansupport such additional functionalities.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of exampleand not by way of limitation in the figures of the accompanyingdrawings, in which like references indicate similar elements and inwhich:

FIGS. 1A-1B illustrate a placement mechanism for facilitating placementof a sensor cover to cover a capacitive circuitry according to oneembodiment of the invention;

FIG. 2 illustrates a computing device employing a sensor and a sensorcover having a channel and holes leading to conductive leads accordingto one embodiment of the invention;

FIG. 3 illustrates a method illustrating a placement mechanism foremploying and facilitating a sensor cover over a sensor of a computingdevice according to one embodiment of the invention; and

FIG. 4 illustrates a computing system according to one embodiment of theinvention.

DETAILED DESCRIPTION

Embodiments of the invention provide a mechanism for employing andfacilitating placing a sensor cover over an external sensor of acomputing device. A method of embodiments of the invention includessensing, at a sensor of a computing device, user touches to an outersurface of an impregnated sensor cover placed over the sensor, whereinthe sensor cover includes a plurality of holes through the outer surfaceand a plurality of conductive leads corresponding to the plurality ofholes, and wherein sensing is performed through one or more of theplurality of holes and their one or more corresponding conductive leads;and facilitating an action in response to each of the sensed usertouches.

In one embodiment, the physical size of a sensor of a computing device(e.g., a touch sensor on the side or on the front a mobile computingdevice) is maintained by adding capacitive characteristics to anenclosure (e.g., sensor cover) itself that is placed over the sensor.Currently, manufacturers of touch panels and touch pads have to shrinktheir flat pad dimensions and place other dimensions on thereduced-sized flat pad or, alternatively, the sensor is to be made toonarrow with diminished width resolution of thumb or finger movement overthe sensor to reduce the overall utility of the sensor and is extremelyundesirable. Embodiments of the present invention provide placing asensor cover over the sensor (without changing the size or dimension ofthe sensor) which eliminates the limitations of the conventionaltechniques. In one embodiment, the sensor cover may be made of plastichaving various conductive properties having capacitive couplingcapabilities to facilitate a novel packaging of plastic cover sensor andwith the sensor using, for example, glue. For example, the plastic coversensor may be shaped to securely cover the sensor for linearizationtransform.

FIG. 1A illustrates a placement mechanism for facilitating placement ofa sensor cover to cover a capacitive circuitry according to oneembodiment of the invention. In one embodiment, the placement mechanism100 provides a sensor cover 102 to be placed over a capacitive circuitry(“sensor”) 112 (e.g., a thumb sensor on the side of a mobile computingdevice) to facilitate a small and tightly-integrated sensor 112 that canbe covered with the sensor cover 102 which provides a bigger area forthe user to use the sensor 112. For example, in one embodiment, thesensor cover 102 may be made of plastic having holes 104 with conductiveleads and a channel 106 to seamlessly accommodate the sensor 112. Thesensor cover 102 and the sensor 112 may be sealed together by, forexample, placing the sensor cover 102 on the portion 114 of thecomputing system using a joining substance, such as a type of apoxy oradhesive glue. This kind of seamless sealing can protect the sensor 112against air, moisture, shifting, and other substances that canpotentially hurt or deteriorate the sensor 112.

In one embodiment, the sensor cover 102 may be made with a type ofplastic or, in some embodiments, other forms of material may be used,such as electronic textiles (e.g., fabric, woven plastic) to properlytransmit heat, power, data, and the like. Sensor cover 102 may be usedover a sensor 112 exposed on a computing device, such as computingdevice 400 of FIG. 4, and may include a mobile computing device, such asa smartphone (e.g., iPhone®, BlackBerry®, etc.), a handheld computingdevice, a personal digital assistant (PDA), a tablet computer (e.g.,iPad®, Samsung® Galaxy Tab®, etc.), a laptop computer (e.g., notebooks,netbooks, etc.), and other similar mobile computing devices, etc.Computing device may further include desktop computers, set-top boxes(e.g., Internet-based cable television set-top boxes, etc.). Computingdevice may further include an operating system serving as an interfacebetween any hardware or physical resources of the computer device and auser. Computing device may further include one or more processors,memory devices, network devices, drivers, or the like. It is to be notedthat terms like “machine”, “device”, “computing device”, “computer”,“computing system”, and the like, are used interchangeably andsynonymously throughout this document.

With mobile computing devices getting smaller and narrower, maintaininga smaller sensor (e.g., human finger sized sensor) is becoming moredesirable. Embodiments of the present invention provide the sensor cover102 to encase the sensor 112 while maintaining the size of the sensor112 such that that the size of the sensor cover 102 may be changed thanrather than the size of the sensor 112. Naturally, changing the size ofthe plastic sensor cover 102 can be much easier than changing the sizeof the electronic sensor 112 due to, for example, the complexity (e.g.,capacitive wiring, etc.) of manufacturing the sensor 112 as opposed tosimply manufacturing a plastic-based sensor cover 102. Further, thesensor 102 can be manufactured separately from the sensor 112 that ismanufactured as part of the computing device.

In one embodiment, as shown with regard to FIG. 1B, an array ofconductive leads 122 is provided through the enclosure or channel 106 ofthe sensor cover 102. As aforementioned and referring back to FIG. 1A,these conductive leads are exposed through a number of holes 104 exposedon the top surface of the sensor cover 102 to fan out the sensor 112regardless of its size, such as a small embedded sensor surface area tothe edge of the plastic-based sensor cover 102. The sensor cover 102 ismade with an array of holes 104 corresponding to the array of conductiveleads 122 such that each of the holes 104 is filled with conductiveepoxy to form the conductive leads 122 and then placed in direct contactwith the underside of the plastic top of the sensor cover 102. Forexample, this can be achieved by placing the sensor 112 into the channel106 or by turning the sensing Printed Circuit Board (PCB) longer edgeperpendicular to the plastics and making longer conductive leads 122 tomatch.

The plastics used to make the sensor cover 102 may be of a highdialectic material to avoid leakage from conductive lead 122 toconductive lead 122. The sensor 112 may then be used to produce X, Ylocation values. To compensate for the surface differences between thearched plastic's outer side and the flat PCB sensing elements, an X, Ytransform is performed before exposing to a computing unit of thecomputing device.

FIG. 2 illustrates a computing device 200 employing a sensor 112 and asensor cover 102 having a channel 106 and holes 104 leading toconductive leads according to one embodiment of the invention. In theillustrated embodiment, the sensor 112 is provided as, for example, athumb sensor placed on a right side of the computing device 200 and at a90 degree angel from the touch panel 202. In one embodiment, each timethe user touches (e.g., presses, rolls, rubs, flicks, etc.) the sensorcover 102, the user touch is sensed by the sensor 112 through the holes104 and via the conductive leads of the sensor cover 102. It iscontemplated that the touch is then received, analyzed and interpretedby various components or modules associated with the sensor and/or oneor more sensing/signaling mechanisms employed by the computing device200.

FIG. 3 illustrates a method illustrating a placement mechanism foremploying and facilitating a sensor cover over a sensor of a computingdevice according to one embodiment. Method 300 may be performed by anynumber of manufacturing techniques and equipment having processing logicthat may comprise hardware (e.g., circuitry, dedicated logic,programmable logic, etc.), software (such as instructions run on aprocessing device), or a combination thereof. In one embodiment, method300 is performed in light of the illustrations of FIGS. 1A, 1B and 2.

Method 300 starts at processing block 305 with manufacturing of acomputing device (e.g., a mobile computing device, such as a smartphone,a tablet computing device, etc.) having various a touchpad or touchpanel as well as a sensor, such as a thumb sensor or thumb pad,somewhere visible on the computing device (e.g., on the left or rightside of the computing device). Similarly, at processing block 310,sensor cover is manufactured at any number of manufacturing facilitiesthat may or may not be related to the manufacturing facilities where thecomputing device is made. The sensor cover may be made using any numberof appropriate materials, such as a type of plastic, electronictextiles, etc.

In one embodiment, at processing block 315, the sensor cover is placedover the sensor. At processing block 320, the placement is thencalibrated such that conductive leads of the sensor cover and the sensorcover itself are properly placed on and calibrated with the sensor tofacilitate fanning out and proper use of the sensor. In one embodiment,the sensor cover may include a number of holes (corresponding to theconductive leads) exposing the sensor to the outside environment as wellas the user's touch such the sensor may sense the user's touch each timethe user touches (e.g., rolls, presses, flicks, etc.) the top of thesensor cover placed on the sensor. At processing block 325, in oneembodiment, the sensor cover is sealed to the peripheral surface (of thecomputing device) surrounding the sensor using a type of glue, etc.

FIG. 4 illustrates a computing system 400 employing and facilitating acover sensor over a sensor of the computing system according to oneembodiment of the invention. The exemplary computing system 400 may bethe same as or similar to the computing device 200 of FIG. 2 andinclude: 1) one or more processors 401 at least one of which may includefeatures described above; 2) a memory control hub (MCH) 402; 3) a systemmemory 403 (of which different types exist such as double data rate RAM(DDR RAM), extended data output RAM (EDO RAM) etc.); 4) a cache 404; 5)an input/output (I/O) control hub (ICH) 405; 6) a graphics processor406; 7) a display/screen 407 (of which different types exist such asCathode Ray Tube (CRT), Thin Film Transistor (TFT), Light Emitting Diode(LED), Molecular Organic LED (MOLED), Liquid Crystal Display (LCD),Digital Light Projector (DLP), etc.; and 8) one or more I/O devices 408.

The one or more processors 401 execute instructions in order to performwhatever software routines the computing system implements. Theinstructions frequently involve some sort of operation performed upondata. Both data and instructions are stored in system memory 403 andcache 404. Cache 404 is typically designed to have shorter latency timesthan system memory 403. For example, cache 404 might be integrated ontothe same silicon chip(s) as the processor(s) and/or constructed withfaster static RAM (SRAM) cells whilst system memory 403 might beconstructed with slower dynamic RAM (DRAM) cells. By tending to storemore frequently used instructions and data in the cache 404 as opposedto the system memory 403, the overall performance efficiency of thecomputing system improves.

System memory 403 is deliberately made available to other componentswithin the computing system. For example, the data received from variousinterfaces to the computing system (e.g., keyboard and mouse, printerport, Local Area Network (LAN) port, modem port, etc.) or retrieved froman internal storage element of the computer system (e.g., hard diskdrive) are often temporarily queued into system memory 403 prior totheir being operated upon by the one or more processor(s) 401 in theimplementation of a software program. Similarly, data that a softwareprogram determines should be sent from the computing system to anoutside entity through one of the computing system interfaces, or storedinto an internal storage element, is often temporarily queued in systemmemory 403 prior to its being transmitted or stored.

The ICH 405 is responsible for ensuring that such data is properlypassed between the system memory 403 and its appropriate correspondingcomputing system interface (and internal storage device if the computingsystem is so designed). The MCH 402 is responsible for managing thevarious contending requests for system memory 403 accesses amongst theprocessor(s) 401, interfaces and internal storage elements that mayproximately arise in time with respect to one another. In oneembodiment, the MCH 502 and ICH 505 may not be separately employed; butrather, be provided as part of a chipset that includes the MCH 502, ICH505, other controller hubs, and the like.

One or more I/O devices 408 are also implemented in a typical computingsystem. I/O devices generally are responsible for transferring data toand/or from the computing system (e.g., a networking adapter); or, forlarge scale non-volatile storage within the computing system (e.g., harddisk drive). ICH 405 has bi-directional point-to-point links betweenitself and the observed I/O devices 408.

Portions of various embodiments of the present invention may be providedas a computer program product, which may include a computer-readablemedium having stored thereon computer program instructions, which may beused to program a computer (or other electronic devices) to perform aprocess according to the embodiments of the present invention. Themachine-readable medium may include, but is not limited to, floppydiskettes, optical disks, compact disk read-only memory (CD-ROM), andmagneto-optical disks, ROM, RAM, erasable programmable read-only memory(EPROM), electrically EPROM (EEPROM), magnet or optical cards, flashmemory, or other type of media/machine-readable medium suitable forstoring electronic instructions.

The techniques shown in the figures can be implemented using code anddata stored and executed on one or more electronic devices (e.g., an endstation, a network element). Such electronic devices store andcommunicate (internally and/or with other electronic devices over anetwork) code and data using computer-readable media, such asnon-transitory computer-readable storage media (e.g., magnetic disks;optical disks; random access memory; read only memory; flash memorydevices; phase-change memory) and transitory computer-readabletransmission media (e.g., electrical, optical, acoustical or other formof propagated signals—such as carrier waves, infrared signals, digitalsignals). In addition, such electronic devices typically include a setof one or more processors coupled to one or more other components, suchas one or more storage devices (non-transitory machine-readable storagemedia), user input/output devices (e.g., a keyboard, a touchscreen,and/or a display), and network connections. The coupling of the set ofprocessors and other components is typically through one or more bussesand bridges (also termed as bus controllers). Thus, the storage deviceof a given electronic device typically stores code and/or data forexecution on the set of one or more processors of that electronicdevice. Of course, one or more parts of an embodiment of the inventionmay be implemented using different combinations of software, firmware,and/or hardware.

In the foregoing specification, the invention has been described withreference to specific exemplary embodiments thereof. It will, however,be evident that various modifications and changes may be made theretowithout departing from the broader spirit and scope of the invention asset forth in the appended claims The Specification and drawings are,accordingly, to be regarded in an illustrative rather than a restrictivesense.

We claim:
 1. A method comprising: placing an outer sensing surface overa sensor of a computing device, wherein the outer sensing surface toserve as an enclosure over the sensor and wherein the outer sensingsurface is impregnated with a plurality of holes corresponding to aplurality of conductive lines leading to the sensor; sensing a usertouch to the outer sensing surface, wherein sensing is performed throughone or more of the plurality of holes and correspondingly through one ormore of the plurality of conductive leads such that the outer sensingsurface serves to replace the sensor while the sensor remains untouchedand unaltered; and facilitating an action in response to the user touch.2. The method of claim 1, wherein the outer sensing surface is made witha conductive material including plastic or electronic textile.
 3. Themethod of claim 1, wherein placing comprises sealing, via glue, theouter sensing surface to a surface area surrounding the sensor such thatthe sensor resides entirely within a channel of the sensor cover and oneor more conductive leads of the sensor are calibrated with the pluralityof conductive leads of the outer sensing surface.
 4. The method of claim1, wherein the sensor comprises a thumb sensor externally placed to aside of the computing device, wherein the thumb sensor is capable ofbeing triggered to perform one or more actions without being touched oraltered and through user touches of the outer sensing surface.
 5. Themethod of claim 1, wherein the computing device comprises a mobilecomputing device including one or more of a smartphone, a handheldcomputing device, a tablet computing device, and an e-reader, whereinthe computing device further includes one or more of a notebook, anetbook, and a desktop computing device.
 6. A non-transitorymachine-readable medium including instructions that, when executed by amachine, cause the machine to: place an outer sensing surface over asensor of a computing device, wherein the outer sensing surface to serveas an enclosure over the sensor and wherein the outer sensing surface isimpregnated with a plurality of holes corresponding to a plurality ofconductive lines leading to the sensor; sense a user touch to the outersensing surface, wherein sensing is performed through one or more of theplurality of holes and correspondingly through one or more of theplurality of conductive leads such that the outer sensing surface servesto replace the sensor while the sensor remains untouched and unaltered;and facilitate an action in response to the user touch.
 7. Thenon-transitory machine-readable medium of claim 6, wherein the outersensing surface is made with a conductive material including plastic orelectronic textile.
 8. The non-transitory machine-readable medium ofclaim 6, wherein placing comprises sealing, via glue, the outer sensingsurface to a surface area surrounding the sensor such that the sensorresides entirely within a channel of the sensor cover and one or moreconductive leads of the sensor are calibrated with the plurality ofconductive leads of the outer sensing surface.
 9. The non-transitorymachine-readable medium of claim 6, wherein the sensor comprises a thumbsensor externally placed to a side of the computing device, wherein thethumb sensor is capable of being triggered to perform one or moreactions without being touched or altered and through user touches of theouter sensing surface.
 10. The non-transitory machine-readable medium ofclaim 6, wherein the computing device comprises a mobile computingdevice including one or more of a smartphone, a handheld computingdevice, a tablet computing device, and an e-reader, wherein thecomputing device further includes one or more of a notebook, a netbook,and a desktop computing device.
 11. An apparatus comprising: an outersensing surface placed over a sensor, wherein the outer sensing surfaceto serve as an enclosure over the sensor and wherein the outer sensingsurface is impregnated with a plurality of holes corresponding to aplurality of conductive lines leading to the sensor, wherein the outersensing surface to sense a user touch, wherein sensing is performedthrough one or more of the plurality of holes and correspondinglythrough one or more of the plurality of conductive leads such that theouter sensing surface serves to replace the sensor while the sensorremains untouched and unaltered, and wherein an action is facilitated inresponse to the user touch.
 12. The apparatus of claim 11, wherein theouter sensing surface is made with a conductive material includingplastic or electronic textile.
 13. The apparatus of claim 11, whereinthe outer sensing surface is placed over the sensor by sealing, viaglue, the outer sensing surface to a surface area surrounding the sensorsuch that the sensor resides entirely within a channel of the sensorcover and one or more conductive leads of the sensor are calibrated withthe plurality of conductive leads of the outer sensing surface.
 14. Theapparatus of claim 11, wherein the sensor comprises a thumb sensorexternally placed to a side of the computing device, wherein the thumbsensor is capable of being triggered to perform one or more actionswithout being touched or altered and through user touches of the outersensing surface.
 15. The apparatus of claim 11, wherein the apparatuscomprises a computing device having a mobile computing device includingone or more of a smartphone, a handheld computing device, a tabletcomputing device, and an e-reader, wherein the computing device furtherincludes one or more of a notebook, a netbook, and a desktop computingdevice.